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To solve the problem of light exhaustion of new energy LED roads, LED street lamp factories should start from the basic materials manufacturers to solve the problem of high-power LED heat dissipation from the inside out. For example, when the LED light-emitting module is bonded to the aluminum substrate, the thermal conductive adhesive plays a key role. Some manufacturers think that the thermal conductivity film or the thermal conductive rubber pad has a high thermal conductivity, and the thicker the better, in fact, this has an effect on the thermal resistance. The thermal conductive film or the soft thermal pad does not really adhere to the substrate. There are actually many pores in the bonding surface. These pores are viewed under an electron microscope, which is like a hollow cavitation, which is another form. Thermal resistance.

The basis of high thermal conductivity is the low thermal resistance of the heat conduction process and the use of high quality thermal conductive adhesive. It is recommended to use the soft ceramic thermal conductive adhesive of the screen printing process. The soft ceramic thermal conductive adhesive of the screen printing process is different from the traditional laminated thermal conductive adhesive film. The soft ceramic thermal conductive adhesive is soft semi-liquid. When coated by the screen printing machine on the aluminum substrate, the thermal conductive particles will penetrate into the pores on the surface of the substrate. And fill it up to full. This results in a completely flat, non-porous plane that will completely conform to the LED chip carrier. In this way, the thermal resistance is reduced to the lowest level, and the thermal energy is quickly conducted out, which naturally reduces the ambient temperature of the LED chip, thereby prolonging the life span and greatly delaying the occurrence of light exhaustion. Since the soft ceramic thermal conductive adhesive of the screen printing process has ductility, the high temperature baking or reflowing will change along with the thermal expansion and contraction of the aluminum substrate, and the stress is very small, and the aluminum substrate will not be bent.